Mechanical

Mechanical

  • Design
  • Structural Characterization
  • Thermal Characterization
  • 3D Modeling
  • Manufacturing
  • Complex Mechanical Models
  • Mobile Structures
  • Materials & Tests
Our mechanical engineering provides external services to other departments and companies.

Mechanical customization based on costumer specifications

RF & MW

RF & MW

  • Extensive experience in Telecom, military, space and science facilities
  • Manufacturing and testing capability from L to W band
  • Passive systems: Waveguides, filters, loads, couplers, transitions, etc.
  • Active systems: Active filters, amplifiers, converters, BUCs, LNBs, SSPAs, etc.
  • Studies: Feasibility, power budgets, thermal studies.
  • Equipment to measure (turnkey). RF chains, Test-Box, etc.

AWGE can customize RF & MW based on costumer specification

Antennas

Antennas

  • Printed, guide or combined. Circular, linear or dual polarization
  • RADAR, UWB, WiMax, etc
  • Reflector Antenna Systems
  • Centered Systems, Off-set, Casse-Grain, Gregorian
  • VSAT, Radio Astronomy, OMTs, point to point links purposes

AWGE can customize Antennas based on customer specification

Cryogenics & UHV

Cryogenics & UHV

    Laboratory Products

  • Cryostats and cryogenic manipulators design.
  • Test equipment: Radio astronomy, energy, etc.

    Cooling

  • Cavities cooling
  • LNA's, isolators, filters
  • Superconducting coils
  • Device and materials analysis

    Advantages

  • Close cycle
  • Up to 4K (-269 ° C)
  • Low consumption, high stability, low-cost maintenance (20kh)
  • Control Interface as defined by the customer
Our Cryogenics & UHV department provides external services to other departments and companies

AWGE can customize Cryo and UHV based on costumer specification

Assembly

Assembly

  • Full management to production
  • Installation of structured coaxial rigid, flexible and semi-rigid wiring
  • DC/ AC/ RF communication modules and RF subsystems wiring
  • Ceramic hybrids, board printing, component mounting, hybrid sealing
  • Assembly of MMIC's, MIC's, transistors and passive components in die using epoxy and eutectic bonding techniques
  • Wire and Die Bonding assembly
  • Adjustment, verification and test
  • Commercial, military and space systems
  • Clean room area (Class 1:10.000)

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